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DTSTART:20070311T020000
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DTSTAMP:20260624T144323
DTSTART;TZID=America/Detroit:20260717T110000
DTEND;TZID=America/Detroit:20260717T120000
SUMMARY:Workshop / Seminar:Quantum Research Institute | Heterogeneous Materials Integration for Photonic Integrated Circuits
DESCRIPTION:In-Person: Duderstadt 1180 (North Campus)\nZoom: https://umich.zoom.us/j/95879021951?jst=2\n\nAbstract\nWafer-bonding is a key enabling technology for the development of complex photonic integrated circuits (PICs) that utilize the best properties of various materials. III-V semiconductors are especially important for such PICs because they offer a wide variety of bandgaps\, very high gain under electrical injection\, large optical nonlinearity\, and wide transparency regions. I will describe some of the projects done by the Quantum Nanophotonics Group at NIST/Boulder over the past several years that utilize wafer-bonding to make novel optoelectronic devices\, including chip-scale nonlinear optics and the demonstration of integrated semiconductor lasers at wavelengths less than 1000 nm.
UID:149111-21905755@events.umich.edu
URL:https://events.umich.edu/event/149111
CLASS:PUBLIC
STATUS:CONFIRMED
CATEGORIES:Applied Physics,Astronomy,Chemistry,Computer Science And Engineering,Electrical And Computer Engineering,Electrical Engineering And Computer Science,Materials Science,Physics,Quantum,Quantum Computing,Quantum Science
LOCATION:Off Campus Location - Duderstadt 1180 (North Campus)
CONTACT:
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