Abstract: Artificial Intelligence (AI) is rapidly reshaping how we work, live, and interact with the entire physical world. This revolution is fundamentally fueled by semiconductor innovation—stretching from energy-efficient transistors to advanced integration technologies like CoWoS®, 3D stacking, and heterogeneous packaging. As power delivery, memory access, and high-speed signaling become critical bottlenecks to AI scaling, next-generation solutions are emerging as vital pillars for system-level performance. At the foundational device level, transistor scaling continues to drive performance – the industry is transitioning from FinFET to Nanosheets. Advanced 2.5D and 3D packaging transcend fundamental reticle limits with fine-pitch hybrid bonding and high-aspect-ratio TSVs. By enabling highly integrated, heterogeneous chiplet architectures, these packaging and integration innovations will deliver unprecedented memory bandwidth and energy efficiency. Overcoming the I/O power wall in next-generation AI fabrics requires Co-Packaged Optics (CPO) powered by advanced silicon photonics like COUPE (Compact Universal Photonic Engine). This new AI platform delivers ultra-low latency, high-density connectivity, and sub-pJ/bit energy efficiency essential for massive AI workloads. This talk will present state-of-the-art semiconductor platform technologies designed for AI applications, while outlining the future opportunities and directions of the industry.

Bio: Dr. Kevin Zhang currently serves as Deputy Co-COO and Senior Vice President at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), where he is responsible for the company-wide business strategy and global sales, including technology roadmap and customer engagement. Before joining TSMC, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel. He was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments in the company. Dr. Zhang has published more than 80 papers at international conferences and in technical journals. He holds 55 U.S. patents in the field of integrated circuit technology. He was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and conference chair for 2021/2022 and currently serves on the Advisory Board of MIT Engineering School. Dr. Zhang is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He holds a Ph.D. degree in Electrical Engineering from Duke University.

Lecture will be followed by a reception in the Masco Commons.